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Author
Hwang, Jennie S
Title
Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly / Jennie S. Hwang.
Imprint
New York : Van Nostrand Reinhold, c1992.
Copies
Description
xxii, 456 p. : ill. ; 24 cm.
Bibliography
Includes bibliographies and index.
Subject
Printed circuits -- Design and construction
Solder pastes
Surface mount technology
ISBN
0442207549
0442013531 (pbk)
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